Process Engineer - Die / Wire bonding
Safran Sensing Technologies Switzerland SA is a world leader in the design and production of silicon microsystems (MEMS). A subsidiary of the Safran Group, we are a human-sized company and place great value on the development of our employees. To support our growth, we wish to welcome, train and support the development of a Process Engineer.
Role based in Yverdon-les-Bains, Switzerland.
Permanent contract, 80-100%, time flexibility, career development, equal opportunity employer.
Your background and knowledge:
• Engineer in micro technology, microelectronics with experience in clean room in an industrial environment or any other experience deemed equivalent
• Minimum 2 years' experience in assembly, wire bonding or lid sealing processes
• In-depth knowledge and interest in data statistical analysis
• Familiar with problem solving methods (8d, FMEA, brainstorming...). Lean manufacturing certification an asset.
• Fluency in both French and English
Your personal profile:
• Ability to work in a team and collaborate with other department, knows how to set objectives, motivate, and report
• Responsible, reliable, organized, autonomous and solution-oriented
• Open to travel in Europe and outside Europe (2 weeks per year)
Your main activities:
• Guarantee and optimize manufacturing processes, and actively participate in the development of new processes for products under development
• Lead packaging equipment selection, qualification, and process validation activities, ensuring alignment with quality standards and production goals.
• Pilot the process transfer and define the surveillance process of our off-shore subcontracting partner (Asia)
Yverdon 