R&D Engineer Power Semiconductor Packaging 80 - 100% (f/m/d)
At Hitachi Energy our purpose is advancing a sustainable? energy future for all. We bring power to our homes, schools, hospitals and factories. Join us and work with fantastic people, while learning and developing yourself on projects that have a real impact on our communities and society. Bring your passion, bring your energy, and be part of a global team that appreciates a simple truth: Diversity + Collaboration = Great Innovation
In our R&D BiMOS department at Hitachi Energy Semiconductors, we are developing faultless high-tech semiconductor devices and power modules. Our quality products are manufactured in advanced internal and external production sites and then delivered to a wide range of customers worldwide for different industrial applications as well as renewable energy, traction and E-mobility.
We are currently looking for a motivated skilled R&D engineer to join the R&D Module team. The focus of the team is to develop new semiconductor power module technologies and products for different markets from initial design phase till final qualification and product release.
Want to shape the future through cutting-edge development? Join our passionate team! We offer a flexible work environment that empowers you to excel, both personally and professionally. You'll have the opportunity to develop your skills and grow alongside talented colleagues.
Your responsibilities
Evaluate new joining methods and materials, investigate scientific foundation and implement technology in power semiconductor modules through qualification stage
Manage projects and sub-projects related to product development for purpose of improving quality and performance as well as streaming costs
Assess design from reliability and manufacturability point of view both experimentally and by modeling/simulation
Build up prototypes and early-stage demonstrators
Document the development works internally, publish findings in journals and conferences, contribute to inventions and patent related to power semiconductor module
Work closely with process engineering team, research bodies and international suppliers as part of development partners
Your background
Degree in material science, mechanical engineering, physics, chemistry or similar disciplines
Keen interest in high-tech products and complex topics together with the motivation to improve products through innovation
Specialist knowledge of relevant joining methods (soldering, welding, sintering, bonding techniques)
Hands-on experimental work and familiar with manufacturing processes ideally in power module packaging area
Ideally already have first industry experience in high-tech field, but talented graduates are also welcome
Knowledge on thermal, electrical and mechanical simulation skills is a plus
Good command of English necessary, German is a plus
Excellent communication, documentation, and presentation skills
